- Use special materials to reduce weight by 40% and prevent deformation

- 3um probe tip diameter detection

-Wafer acceptance test

-Through MEMS process, it is made with self-developed and manufactured PIN and materials that meet the characteristics of Low Lease

- Ultramicro spacing

- Alloy probe with less cleanliness

-Ultramicro spacing

-Alloy probe with less cleanliness

-It is less abrasive than tungsten cobra probe and has a long service life

-Machining probe

-Used for SOC pad/bump test

-High geometric accuracy/micro spacing capability/high-speed capability

-Low contact force/low pad/damaged bump/high CCC/easy to replace pin

-It can be used for mobile products DRAM (ex. mobile phone, navigation, etc.)